罗斌森
  • TPS254900AIRVCTQ1

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Active
    Package / Case : 20-WFQFN Exposed Pad
    Supplier Device Package : 20-WQFN (4x3)

极速报价

型号
品牌 封装 批号 查看
DS3695ATM/NOPB TI 8-SOIC New 详细
THS3001HVIDGN TI 8-MSOP-PowerPad New 详细
VCBUP7CT7 TI 529-FCBGA (19x19) New 详细
DBB03AIPMR TI 64-LQFP (10x10) New 详细
CD74AC244M TI 20-SOIC New 详细
LM4041DIM7-1.2 TI SC-70-5 New 详细
DS90CP22M-8/NOPB TI 16-SOIC New 详细
SN74HCT02DT TI 14-SOIC New 详细
ISO7221CHD TI 8-SOIC New 详细
CD74HC4052PW TI 16-TSSOP New 详细
TPS22942DCKR TI SC-70-5 New 详细
MSP430FR5728IRGER TI 24-VQFN (4x4) New 详细
CSD96371Q5M TI 22-LSON-CLIP (6x5) New 详细
TRS202ECPWR TI 16-TSSOP New 详细
SN65LVDT34D TI 8-SOIC New 详细
PCM1718E TI 20-SSOP New 详细
ADS1296RIZXGT TI 64-NFBGA (8x8) New 详细
PCM1771RGA TI 20-VQFN (4.2x4.2) New 详细
SN74ACT7814-25DLR TI 56-SSOP New 详细
CC3000MOD TI New 详细