产品系列
TMS5702135CZWTQQ1
- Manufacturer : Texas Instruments
Packaging : Tray
Series : Automotive, AEC-Q100, Hercules? TMS570 ARM? Cortex?-R
Part Status : Obsolete
Core Processor : ARM? Cortex?-R4F
Core Size : 16/32-Bit
Speed : 180MHz
Connectivity : CANbus, EBI/EMI, FlexRay, I2C, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals : DMA, POR, PWM, WDT
Number of I/O : 120
Program Memory Size : 2MB (2M x 8)
Program Memory Type : FLASH
EEPROM Size : 64K x 8
RAM Size : 256K x 8
Voltage - Supply (Vcc/Vdd) : 1.14V ~ 3.6V
Data Converters : A/D 24x12b
Oscillator Type : External
Operating Temperature : -40°C ~ 125°C (TA)
Mounting Type : Surface Mount
Package / Case : 337-LFBGA
Supplier Device Package : 337-NFBGA (16x16)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| TPS73633MDBVREP | TI | SOT-23-5 | New | 详细 | |
| AM3352BZCZA100 | TI | 324-NFBGA(15x15) | New | 详细 | |
| TLV2461AQDR | TI | 8-SOIC | New | 详细 | |
| ADS8317IBDRBT | TI | 8-SON (3x3) | New | 详细 | |
| LPC660AIM/NOPB | TI | 14-SOIC | New | 详细 | |
| SN65MLVD205DRG4 | TI | 14-SOIC | New | 详细 | |
| LP3855ESX-3.3/NOPB | TI | DDPAK/TO-263-5 | New | 详细 | |
| DS64EV100SDX/NOPB | TI | 14-WSON (4x3) | New | 详细 | |
| LP87524BRNFTQ1 | TI | 26-VQFN-HR (4.5x4) | New | 详细 | |
| ISO7731DWR | TI | 16-SOIC | New | 详细 | |
| RF430CL330HIRGTR | TI | 16-VQFN (3x3) | New | 详细 | |
| SN74BCT374NSR | TI | New | 详细 | ||
| LM4431M3X-2.5 | TI | SOT-23-3 | New | 详细 | |
| LP2985-10DBVT | TI | SOT-23-5 | New | 详细 | |
| LM57TSPWQ1 | TI | 8-TSSOP | New | 详细 | |
| CP3BT10G38 | TI | 100-QFP (14x14) | New | 详细 | |
| TL431LIAQDBZR | TI | New | 详细 | ||
| OPA2251UA/2K5 | TI | 8-SOIC | New | 详细 | |
| 74ACT11240NT | TI | 24-PDIP | New | 详细 | |
| MSP430F5254IRGCT | TI | 64-VQFN (9x9) | New | 详细 |
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