产品系列
产品系列
XC7Z007S-1CLG400C
- Manufacturer : Xilinx Inc.
Packaging : Tray
Series : Zynq?-7000
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Single ARM? Cortex?-A9 MPCore? with CoreSight?
RAM Size : 256KB
Peripherals : DMA
Connectivity : CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 667MHz
Primary Attributes : Artix?-7 FPGA, 23K Logic Cells
Operating Temperature : 0°C ~ 85°C (TJ)
Package / Case : 400-LFBGA, CSPBGA
Supplier Device Package : 400-CSPBGA (17x17)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| XC2V1000-5BGG575I | Xilinx | 575-BGA (31x31) | New | 详细 | |
| XCS30-3PQ208C | Xilinx | 208-PQFP (28x28) | New | 详细 | |
| EFR-DI-OBSAI-WW | Xilinx | New | 详细 | ||
| XC2V1500-4BG575I | Xilinx | 575-BGA (31x31) | New | 详细 | |
| XC3S50A-4TQG144C | Xilinx | 144-TQFP (20x20) | New | 详细 | |
| XC17V16PC44I | Xilinx | 44-PLCC (16.59x16.59) | New | 详细 | |
| XC4VFX60-11FF1152I | Xilinx | 1152-CFCBGA (35x35) | New | 详细 | |
| XCV100E-8FG256C | Xilinx | 256-FBGA (17x17) | New | 详细 | |
| HW-SPAR3E-SK-UNI-G | Xilinx | New | 详细 | ||
| XC7Z035-1FFG900I | Xilinx | 900-FCBGA (31x31) | New | 详细 | |
| XC6SLX45-N3FG484C | Xilinx | 484-FBGA (23x23) | New | 详细 | |
| XCV150-4FG256C | Xilinx | 256-FBGA (17x17) | New | 详细 | |
| XC5VLX110T-3FFG1738C | Xilinx | 1738-FCBGA (42.5x42.5) | New | 详细 | |
| XC6SLX100T-3FGG484C | Xilinx | 484-FBGA (23x23) | New | 详细 | |
| XC7K325T-L2FFG676E | Xilinx | 676-FCBGA (27x27) | New | 详细 | |
| XC5VLX50T-1FFG665I | Xilinx | 665-FCBGA (27x27) | New | 详细 | |
| XC7Z045-1FFG676C | Xilinx | 676-FCBGA (27x27) | New | 详细 | |
| XC95216-15HQ208C | Xilinx | 208-PQFP (28x28) | New | 详细 | |
| XC7Z030-1SBG485C | Xilinx | 485-FBGA (19x19) | New | 详细 | |
| DK-U1-VCU110-ES3-G | Xilinx | New | 详细 |
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