产品系列
CSD86330Q3D
- Manufacturer : Texas Instruments
Packaging : Cut Tape (CT)
Alternate Packaging
Series : NexFET?
Part Status : Active
FET Type : 2 N-Channel (Half Bridge)
FET Feature : Logic Level Gate
Drain to Source Voltage (Vdss) : 25V
Current - Continuous Drain (Id) @ 25°C : 20A
Rds On (Max) @ Id, Vgs : 9.6 mOhm @ 14A, 8V
Vgs(th) (Max) @ Id : 2.1V @ 250μA
Gate Charge (Qg) (Max) @ Vgs : 6.2nC @ 4.5V
Input Capacitance (Ciss) (Max) @ Vds : 920pF @ 12.5V
Power - Max : 6W
Operating Temperature : -55°C ~ 150°C (TJ)
Mounting Type : Surface Mount
Package / Case : 8-PowerLDFN
Supplier Device Package : 8-LSON (3.3x3.3)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| LM60BIM3 | TI | SOT-23-3 | New | 详细 | |
| SN74ABT8543DWR | TI | 28-SOIC | New | 详细 | |
| SN74HC241NSR | TI | 20-SO | New | 详细 | |
| SN74CBTLV3125NSRG4 | TI | 14-SOP | New | 详细 | |
| TPS51716RUKT | TI | 20-WQFN (3x3) | New | 详细 | |
| TLV2376IDR | TI | 8-SOIC | New | 详细 | |
| CD74HCT356M96 | TI | 20-SOIC | New | 详细 | |
| TMP122AIDBVR | TI | SOT-23-6 | New | 详细 | |
| SN74ABT823DBR | TI | New | 详细 | ||
| LM3555TLE/NOPB | TI | 12-TμSMD (1.58x2.1) | New | 详细 | |
| LMR10510YSDDEMO/NOPB | TI | New | 详细 | ||
| LM4050QAEM3X4.1/NOPB | TI | SOT-23-3 | New | 详细 | |
| TPS2092DR | TI | 8-SOIC | New | 详细 | |
| MSP430F5503IRGZT | TI | 48-VQFN (7x7) | New | 详细 | |
| LP38502SD-ADJEV | TI | New | 详细 | ||
| REF3318AIDBZT | TI | SOT-23-3 | New | 详细 | |
| TMP235A4DBZR | TI | SOT-23-3 | New | 详细 | |
| SN74LVC540ANSR | TI | 20-SO | New | 详细 | |
| MAX3232ECDR | TI | 16-SOIC | New | 详细 | |
| LM335M/NOPB | TI | 8-SOIC | New | 详细 |
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