产品系列
CSD86330Q3D
- Manufacturer : Texas Instruments
Packaging : Cut Tape (CT)
Alternate Packaging
Series : NexFET?
Part Status : Active
FET Type : 2 N-Channel (Half Bridge)
FET Feature : Logic Level Gate
Drain to Source Voltage (Vdss) : 25V
Current - Continuous Drain (Id) @ 25°C : 20A
Rds On (Max) @ Id, Vgs : 9.6 mOhm @ 14A, 8V
Vgs(th) (Max) @ Id : 2.1V @ 250μA
Gate Charge (Qg) (Max) @ Vgs : 6.2nC @ 4.5V
Input Capacitance (Ciss) (Max) @ Vds : 920pF @ 12.5V
Power - Max : 6W
Operating Temperature : -55°C ~ 150°C (TJ)
Mounting Type : Surface Mount
Package / Case : 8-PowerLDFN
Supplier Device Package : 8-LSON (3.3x3.3)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| SN74LV125ATPWT | TI | 14-TSSOP | New | 详细 | |
| LM71CISDX | TI | 6-WSON (3x3) | New | 详细 | |
| PCM1792DB | TI | 28-SSOP | New | 详细 | |
| UC2844AD8TR | TI | 8-SOIC | New | 详细 | |
| REG104GA-3.3/2K5 | TI | SOT-223-6 | New | 详细 | |
| TPS61054DRCR | TI | 10-VSON (3x3) | New | 详细 | |
| LP38691SDX-3.3 | TI | 6-WSON (3x3) | New | 详细 | |
| LM2621EVAL | TI | New | 详细 | ||
| SN74F541NSR | TI | 20-SO | New | 详细 | |
| OPA1688EVM | TI | New | 详细 | ||
| MAX3237EIDWR | TI | 28-SOIC | New | 详细 | |
| LM2608ATL-1.3/NOPB | TI | 10-TμSMD (2.25x2.5) | New | 详细 | |
| LP5951MG-2.5/NOPB | TI | SC-70-5 | New | 详细 | |
| TLV320AIC13IDBT | TI | 30-TSSOP | New | 详细 | |
| UCC3806N | TI | 16-PDIP | New | 详细 | |
| LMC6772AIMM | TI | 8-VSSOP | New | 详细 | |
| TM4C129XNCZADI3 | TI | 212-NFBGA (10x10) | New | 详细 | |
| LM9036QM-5.0/NOPB | TI | 8-SOIC | New | 详细 | |
| LM2676T-12 | TI | TO-220-7 | New | 详细 | |
| LM25141QRGETQ1 | TI | 24-VQFN (4x4) | New | 详细 |
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