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  • MSP430F122IPW

  • Manufacturer : Texas Instruments
    Packaging : Tube
    Alternate Packaging
    Series : MSP430x1xx
    Part Status : Active
    Core Processor : MSP430
    Core Size : 16-Bit
    Speed : 8MHz
    Connectivity : SPI, UART/USART
    Peripherals : POR, PWM, WDT
    Number of I/O : 22
    Program Memory Size : 4KB (4K x 8 + 256B)
    Program Memory Type : FLASH
    RAM Size : 256 x 8
    Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
    Data Converters : Slope A/D
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 85°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 28-TSSOP (0.173", 4.40mm Width)
    Supplier Device Package : 28-TSSOP

极速报价

型号
品牌 封装 批号 查看
LM2677SDX-ADJ TI 14-VSON (5x6) New 详细
LP3981IMM-3.0 TI 8-VSSOP New 详细
TLK2201AIRCPG4 TI 64-HVQFP New 详细
MSP430F2012IRSAT TI 16-QFN (4x4) New 详细
LP3963ESX-5.0 TI DDPAK/TO-263-5 New 详细
TPS3306-18D TI 8-SOIC New 详细
TAS5782MDCAR TI 48-HTSSOP New 详细
OPA4316QPWRQ1 TI 14-TSSOP New 详细
TMX5703134BPGEQQ1 TI 144-LQFP (20x20) New 详细
BQ25120YFPT TI 25-DSBGA New 详细
LM3501TLX-16/NOPB TI 8-uSMD New 详细
LM25056PSQX/NOPB TI 24-WQFN (4x5) New 详细
SN74ALS992NTG4 TI 24-PDIP New 详细
TL3414AIPWR TI 8-TSSOP New 详细
CLC001AJE TI 8-SOIC New 详细
ADS5474ADX-EVM TI New 详细
ALM2402QPWPRQ1 TI 14-HTSSOP New 详细
SN64BCT126ANG4 TI 14-PDIP New 详细
CD4052BPWRG4 TI 16-TSSOP New 详细
LP3966ES-3.3/NOPB TI DDPAK/TO-263-5 New 详细