产品系列

罗斌森
  • MSP430F155IPM

  • Manufacturer : Texas Instruments
    Packaging : Tray
    Alternate Packaging
    Series : MSP430x1xx
    Part Status : Active
    Core Processor : MSP430
    Core Size : 16-Bit
    Speed : 8MHz
    Connectivity : I2C, SPI, UART/USART
    Peripherals : Brown-out Detect/Reset, DMA, POR, PWM, WDT
    Number of I/O : 48
    Program Memory Size : 16KB (16K x 8 + 256B)
    Program Memory Type : FLASH
    RAM Size : 512 x 8
    Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
    Data Converters : A/D 8x12b; D/A 2x12b
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 85°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 64-LQFP
    Supplier Device Package : 64-LQFP (10x10)

极速报价

型号
品牌 封装 批号 查看
TLV2460QD TI 8-SOIC New 详细
THS3201DG4 TI 8-SOIC New 详细
TPS7A4501KTTR TI DDPAK/TO-263-5 New 详细
LP2985AIM5-4.0/NOPB TI SOT-23-5 New 详细
SN74F174ANSRE4 TI New 详细
TMS320VC5510AZGWA2 TI 240-BGA MicroStar (15x15) New 详细
LM2673SX-3.3/NOPB TI DDPAK/TO-263-7 New 详细
TPD4S012DRYR TI 6-SON (1.45x1) New 详细
TMS320DM355DZCE216 TI 337-NFBGA (13x13) New 详细
SN74ABT5401DWE4 TI 28-SOIC New 详细
SN74LVC139AD TI 16-SOIC New 详细
HPC46003V20/NOPB TI 68-PLCC (25.13x25.13) New 详细
PT78NR206ST TI New 详细
LMV932MA TI 8-SOIC New 详细
PTH12010YAZT TI New 详细
OPA1604AIPWR TI 14-TSSOP New 详细
LP38502ASD-ADJ/NOPB TI 8-WSON (3x2.5) New 详细
LP3879SDX-1.0 TI 8-WSON (4x4) New 详细
LMC6041IN TI 8-PDIP New 详细
TMX320DM365AZCE TI 338-NFBGA (13x13) New 详细