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  • LM3S315-EGZ25-C2

  • Manufacturer : Texas Instruments
    Packaging : Tray
    Series : Stellaris? ARM? Cortex?-M3S 300
    Part Status : Discontinued at Digi-Key
    Core Processor : ARM? Cortex?-M3
    Core Size : 32-Bit
    Speed : 25MHz
    Connectivity : Microwire, SPI, SSI, UART/USART
    Peripherals : Brown-out Detect/Reset, POR, PWM, WDT
    Number of I/O : 32
    Program Memory Size : 16KB (16K x 8)
    Program Memory Type : FLASH
    RAM Size : 4K x 8
    Voltage - Supply (Vcc/Vdd) : 3V ~ 3.6V
    Data Converters : A/D 4x10b
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 105°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 48-VFQFN Exposed Pad
    Supplier Device Package : 48-VQFN (7x7)

极速报价

型号
品牌 封装 批号 查看
SN74LVC08ADRG3 TI 14-SOIC New 详细
DS481TMX/NOPB TI 8-SOIC New 详细
SN74LV163APWR TI 16-TSSOP New 详细
LM3S612-IGZ50-C2 TI 48-VQFN (7x7) New 详细
RC4560IPWR TI 8-TSSOP New 详细
TPS3705-30DR TI 8-SOIC New 详细
LM5045EVAL/NOPB TI New 详细
TLC2254QDG4 TI 14-SOIC New 详细
UCC281DPTR-5 TI 8-SOIC New 详细
SN74LS640-1NSR TI 20-SO New 详细
TPS79228DBVR TI SOT-23-5 New 详细
LM34922MY/NOPB TI 10-MSOP-PowerPad New 详细
REF3312AIRSER TI 8-UQFN (1.5x1.5) New 详细
MSP-EXP430G2ET TI New 详细
SN75123N TI 16-PDIP New 详细
LMH6559MF TI SOT-23-5 New 详细
PT5025M TI New 详细
ONET1131ECRSMR TI 32-VQFN (4x4) New 详细
SN74HC02D TI 14-SOIC New 详细
BQ4013YMA-120 TI 32-DIP Module (18.42x42.8) New 详细